Digitimes is not rated as a very dependable source for future technology but the site has recently asserted that big smartphone makers like Apple, Samsung and HTC are looking to introduce liquid-cooled handsets in the near future. Here is an excerpt from the original Digitimes report which says that, “Smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected to release heat pipe-adopted models in the fourth quarter, at the earliest, according to sources from cooling module player.”
However, the liquid-cooled technology is not far-fetched as it may sound because a Japanese electronics manufacturer known as NEC has already introduced it in its latest smartphone the Medias X 06 E that was released in Japan last month. The Medias X 06 E smartphone of NEC was nicknamed the ladyphone because it was especially created for females, who have complained about the heat their smartphones produce. Apart from being a liquid-cooled mobile phone the NEC Medias X 06 E has nothing special to offer, as just like any other high-end smartphone it boasts a 4.7-inch display and 1.7Ghz quad-core Snapdragon processor.
A majority of the smartphones that we see today incorporate a graphite ‘radiator’ along with foil in order to pass on the heat to the outer casing, so it can be dispelled. In contrast to them NEC Medias X 06 E uses a liquid cooling system that can also be found on some ultrabooks as well, which basically uses a pipe that is filled with coolant to transfer the heat away from wireless chips and CPU. The only difference between the cooling system of those ultrabooks and Medias X 06 E is that NEC has used smaller pipes in its smartphone, which are about half the size of ultrabooks’ 1.1mm pipes.
Coming back to the Digitimes’ claim the website expects that the leading smartphone makers will most probably adopt the liquid-cooling technology by the end of this year, but it seems unlikely. For the reason that currently numerous companies are developing this technology for mobile phones, but the yield rate is said to be around 30 percent only. However, as the processors of the smartphones are becoming heavier and the 4G chips are producing more heat, it is expected that perhaps liquid cooling technology will become normal for smartphones in the coming years.
Source: 9to5Google
Photo: WonderfulEngineering
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